01 / Mission
The Role
MKIS Precision Search is conducting a confidential search for a Director of Advanced Packaging Engineering on behalf of an established semiconductor innovator. This leader will set the technical direction for packaging platforms that enable performance, reliability, and scale across demanding commercial and defense applications.
02 / Execution
What You'll Do
- Define and execute the advanced packaging technology roadmap across 2.5D, 3D, and heterogeneous integration platforms.
- Build, mentor, and direct a multidisciplinary engineering organization spanning design, process, reliability, and operations.
- Partner with executive leadership, customers, and external foundry and OSAT partners to move programs from concept to production.
- Establish the operating cadence, technical standards, and decision frameworks required to deliver against critical program milestones.
03 / Readiness
What We're Looking For
- 12+ years of progressive experience in semiconductor packaging, integration, or a closely related discipline.
- Demonstrated leadership of technical teams and complex, cross-functional development programs.
- Deep working knowledge of advanced packaging architectures, materials, thermal management, and reliability qualification.
- B.S. in Electrical, Mechanical, Materials Science, or Chemical Engineering; advanced degree preferred.
- U.S. citizenship required. Ability to obtain and maintain a security clearance is preferred.
04 / Terms
Compensation Range
$220,000 – $285,000 base salary · Executive incentive plan · Full benefits